Deposit of thin films

The Beneq TFS 200 atomic layer deposition system (ALD) is an equipment that makes it possible to synthesize materials that interest the academic community and the industrial sector. The materials and structures manufactured in this type of reactor include semiconductors, luminescent, multiferroic, catalytic materials, and ultra-hard coatings, among others. The system allows the synthesis of thin films at the nanometer scale and with control of the thickness through thermal ALD and plasma-assisted ALD (PEALD).

The oxides calibrated in this reactor are Al2O3, ZnO, TiO2 and HfO2, ZrO2, Y2O3, YSZ, and their different combinations.

Features:

Thermal ALD film deposit with substrate temperature up to 500 °C. The system has four sources: two liquid sources at room temperature and two hot up to 300 °C.

Film deposit by direct or remote PEALD with RF source up to 300 W, with argon, oxygen, and/or nitrogen plasma.

To reserve, use the following link: https://www.supersaas.es/schedule/ALD/ALD

SCS Labcoter® 2 Vacuum Deposition System (PDS 2010). It allows making conformal parylene coatings (known in English as parylene) to samples for their encapsulation or protection, avoiding deterioration or contamination of the device or piece.

The furnace is a Thermo Scientific for 6" diameter tubes. It produces heating in 3 zones, each of which can be controlled independently. The maximum temperature is 1,000 °C.