Etching

Acid and base hoods are designed to handle acids and bases in laboratory procedures safely. Hoods come in 48", 60", and 72" dimensions and include a unique flush and exhaust system. The PVC-constructed UniFlow superstructure features unique double-wall construction for superior chemical resistance, strength, and durability. The hood features deionized water for washing samples and a nitrogen gun for drying them.Acid and base hoods are designed to handle acids and bases in laboratory procedures safely. Hoods come in 48", 60", and 72" dimensions and include a unique flush and exhaust system. The PVC-constructed UniFlow superstructure features unique double-wall construction for superior chemical resistance, strength, and durability. The hood features deionized water for washing samples and a nitrogen gun for drying them.

The PE-50 system allows modifications to a surface with Ar or O2 plasma. The maximum power achieved is 100 W. The PE-100 system allows pickling with gases such as CF4 and CHF3 at the highest power of 300 W.

It also is used to etch polymers such as parylene.

Plasma etching equipment can operate in various modes by adjusting the plasma parameters. An ordinary plasma runs between 0.05 and 5 Torr. The plasma produces energetic, neutrally charged free radicals that react on the sample's surface. Since the neutral particles attack the wafer from all angles, this process is isotropic.

The gas source for the plasma usually contains small molecules rich in chlorine or fluorine. For example, carbon tetrachloride (CCl4) etches silicon and aluminum, and trifluoromethane (CHF3) etches silicon dioxide and silicon nitride. An oxygen-containing plasma is used to etch polymers.